- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/04 - Containers; Seals characterised by the shape
Patent holdings for IPC class H01L 23/04
Total number of patents in this class: 1372
10-year publication summary
|
111
|
130
|
122
|
140
|
112
|
97
|
91
|
69
|
68
|
21
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
102 |
| Kyocera Corporation | 12735 |
100 |
| Mitsubishi Electric Corporation | 43934 |
67 |
| International Business Machines Corporation | 60644 |
45 |
| Fuji Electric Co., Ltd. | 4750 |
38 |
| Intel Corporation | 45621 |
35 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
33 |
| Micron Technology, Inc. | 24960 |
32 |
| Samsung Electronics Co., Ltd. | 131630 |
28 |
| Invensas Corporation | 645 |
25 |
| Infineon Technologies AG | 8189 |
22 |
| Daishinku Corporation | 220 |
22 |
| Murata Manufacturing Co., Ltd. | 22355 |
21 |
| STATS ChipPAC Pte. Lte. | 1516 |
21 |
| Amkor Technology Singapore Holding Pte.ltd. | 555 |
19 |
| Renesas Electronics Corporation | 6305 |
17 |
| Infineon Technologies Americas Corp. | 768 |
13 |
| Xilinx, Inc. | 4086 |
12 |
| Rohm Co., Ltd. | 5843 |
11 |
| BroadPak Corporation | 17 |
11 |
| Other owners | 698 |